A major foreign-invested semiconductor project has moved forward in Guangzhou's Baiyun district after Donghan Semiconductor (Guangdong) bid for a land parcel in the Guangzhou Private Science and Technology Park on May 15.

The land parcel, designed for the first-phase STI Semiconductor Device Smart Manufacturing Base, is based on an investment exceeding 1.5 billion yuan ($220.24 million). It will primarily produce AMB ceramic substrates, a key material for power semiconductor modules used in new energy vehicles, smart grids and other strategic emerging industries. The project is expected to generate over 3 billion yuan in annual output once fully operational.

A design sketch for the first-phase STI semiconductor project. [Photo/WeChat account: gz_baiyunfabu]

It will fill a critical gap in Baiyun's integrated circuit supply chain, forming upstream-downstream synergies with existing players. It is also expected to attract supporting enterprises and help the district build a complete semiconductor ecosystem spanning design, manufacturing, packaging and testing.

To facilitate the project, Baiyun authorities have provided dedicated one-on-one services, including pre-leveled land and expedited utility arrangements. "The rapid land acquisition is a vote of confidence from foreign investors in Baiyun's business environment," a district official said.